Industry Directory | Manufacturer
VisionMaster is the original longtime manufacturer of advanced yet affordable 3-D solder paste inspection (SPI) equipment. VisionMaster provides best-in-class 3D white light technology and repeatability at laser technology prices.
I.C.T High Precision SMT PCB Dispensing Machine ❙ Introdution : Introduction: As functionality and performance increase in the electronics field, there is an increasing need for finer and more precise coatings. The HD series machine is a micro-
New Equipment | Solder Paste Stencils
Automatic Solder paste printer Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Power Supply: AC:220±10%,50/60HZ ,Control Method: PC Control,PCB Size/
Electronics Forum | Sat Feb 04 23:09:00 EST 2012 | jorge_quijano
Thanks for the info, I will check tolerances and the quadaling option. As an update I ran this past week and machine was arround 5% for a very small lot size, for a larger size lot it was less than 2%, Now I know it still higher than our newest machi
Electronics Forum | Fri May 15 08:04:32 EDT 2009 | rwyman
higher temp/shorter time). Solder mask may be a factor as well. I've seen parts get knocked off where the glue is still affixed to the part, along with a nice piece of solder mask from the board. If you can knock a part off with casual contact, th
Industry News | 2013-10-09 10:29:04.0
GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.
Industry News | 2012-06-11 12:24:54.0
GPD Global announces that it will exhibit in Booth #6085 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Technical Library | 2022-07-11 09:24:48.0
The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.
Technical Library | 2018-03-21 22:44:30.0
Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled, defects can be produced, which may not become apparent until the PCBA is downstream. (...)This paper will discuss how Lean Six Sigma techniques were used to optimize the solder paste printing process. It will highlight how a cross-functional team used the structured Define, Measure, Analyze, Improve and Control (DMAIC) methodology to identify and control the critical inputs. The advantage of the Lean Six Sigma methodology is that it guides the team through the rigorous structured process so that all possible inputs are considered and the critical ones can be identified.
This is the first in a series of 10-minute videos to introduce new users to the basics of machine vision technology. In this video, users will learn what machine vision is, how it is used in factory automation, and its four most common applications.
How to Maintain a Reflow Oven Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow ove
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
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IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts. During QFP analysis, for example, the rotational accuracy can
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/solderplus-solder-paste
. Read More Halogens and Halides: Consider Halogen-Free Flux and Solder Paste Fluid Dispensing 101: How to Fill a Syringe Barrel Mar 31, 2020 Find out how to properly fill a syringe barrel
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
How to Prevent a Solder Ball Defect | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
